We've been working very hard over the past few months, and I'm very proud to "release" version 0.2. I set up a shiny new dedicated Pyston blog, and you can see the announcement here: http://blog.pyston.org/2014/09/11/9/
I'm putting "release" in quotes since we're not distributing binaries due to the "early access" nature, and in fact the v0.2 tag in the repository is already out of date and there are a number of features that have landed on trunk. But still, I think it's a milestone deserving of a version number bump.
Sometimes I start a project thinking it will be about one thing: I thought my FPGA project was going to be about developing my Verilog skills and building a graphics engine, but at least at first, it was primarily about getting JTAG working. (Programming Xilinx FPGAs is actually a remarkably complicated story, typically involving people reverse engineering the Xilinx file formats and JTAG protocol.) I thought my 3D printer would be about designing 3D models and then making them in real life -- but it was really about mechanical reliability. My latest project, which I haven't blogged about since I was trying to hold off until it was done, is building a single board computer (pcb photo here) -- I thought it'd be about the integrity of high-speed signals (DDR3, 100Mbps ethernet), but it's actually turned out to be about BGA soldering.
I've done some BGA soldering in the past -- I created a little test board for Xilinx CPLDs, since those are 1) the cheapest BGA parts I could find, and 2) have a nice JTAG interface which gives us an easy way of testing the external connectivity. After a couple rough starts with that I thought I had the hang of it down, so I used a BGA FPGA in my (ongoing) raytracer project. I haven't extensively tested the soldering on that board, but the basic functionality (JTAG and VGA) were brought up successfully, so for at least ~30 of the pins I had a 100% success rate. So I thought I had successfully conquered BGA soldering, and I was starting to think about whether or not I could do 0.8mm BGAs, and so on.
My own SBC
Fast forward to trying to build my own single board computer (SBC). This is something I've been thinking about doing for a while -- not because I think the world needs another Raspberry-Pi clone, but because I want to make one as small as possible and socket it into a backplane for a small cluster computer. Here's what I came up with:
Sorry for the lack of reference scale, but these boards are 56x70mm, and I should be able to fit 16 of them into a mini-ITX case. The large QFP footprint is for an Allwinner A13 processor -- not the most performant option out there, but widely used so I figured it'd be a good starting point. The assembly went fairly smoothly: I had to do a tiny bit of trace cutting and added a discrete 10k resistor, and I forgot to solder the exposed pad of the A13 (which is not just for thermal management, but is also the only ground pin for the processor), but after that, it booted up and I got a console!
The console was able to tell me that there was some problem initializing the DDR3 DRAM, at which point the processor would freeze. I spent some time hacking around in the U-Boot firmware to figure out what was going wrong, and the problems started with the processor failing in "training", or learning of optimal timings. I spent some time investigating that, and wasn't able to get it to work.
So I bought an Olimex A13 board, and decided to try out my brand of memory on it, since it's not specified to be supported. I used my hot air tool to remove the DDR3 chip from the Olimex board and attach one of mine, and... got the same problem. I was actually pretty happy with that, since it meant that there was a problem with the soldering or the DRAM part, which is much more tractable than a problem with trace length matching or single integrity.
I tried quite a few times to solder the DRAM onto the Olimex board, using a number of different approaches (no flux, flux, or solder paste). In the end, on the fifth attempt, I got the Olimex board to boot! So the memory was supported, but my "process yield" was abysmal. I didn't care, and I decided to try it again on my board, with no luck. So I went back to the Olimex board: another attempt, didn't work. Then I noticed that my hot air tool was now outputting only 220C air, which isn't really hot enough to do BGA reflow. (I left a 1-star review on Amazon -- my hopes weren't high for that unit, but 10-reflows-before-breaking was not good enough.)
I ordered myself a nicer hot air unit (along with some extra heating elements for the current one in case I can repair it, but it's not clear that the heating element is the issue), which should arrive in the next few days. I'm still holding out hope that I can get my process to be very reliable, and that there aren't other problems with the board. Hopefully my next blog post will be about how much nicer my new hot air tool is, and how it let me nail the process down.
I've seen a lot of references to the wearables market lately with a lot of people getting very excited about it. I can't tell though, is it actually a thing that people will really want? Lots of companies are jumping into it and trying to provide offerings, and the media seems to be taking it seriously, but even though I work at a tech company in San Francisco, I haven't seen a single person wearing one or talking about it.
I can see why companies are jumping into it: a lot of them got burned by not taking tablets seriously, and look where that market ended up now. A potential new market, which could provide a new revenue stream, has to be the dream for any exec, and it could make a lot of sense to get a jump start on a new market even if there are doubts about it.
That said, I'm feeling like wearables might be a similar market to 3d printers: it makes a lot of sense that in the future those things will be very big, but I think there's a very long road ahead. I'm not sure there's going to be a single killer feature for either of them, so adoption could be slow -- though I think once they take off they'll get integrated into our day-to-day.
But who knows, I was a tablet naysayer when they came out, and maybe Apple will release an iWatch which will define and launch the wearables market as well. But especially when it comes to the "smart watch" wearable, I think it will be more similar to netbooks, and even though a number of companies will push hard, people will gravitate to other form factors.
http://www.wired.com/2014/08/isp-bitcoin-theft/ Looks like this is an implementation of what I described previously. This guy used BGP to route internet traffic to him -- the article is light on the technical details but my guess is that he masqueraded as a popular bitcoin pool and gave out orders that benefited him rather than the real pool.
The problem is that while the base Bitcoin protocol is secure (as far as I know), there are huge ecosystems built on top of it, most of which haven't had the same scrutiny. The worst I've seen is the "stratum mining protocol": it distributes the mining work well, but I don't think anyone has paid any attention to its security. There isn't any authentication of either endpoint: you don't really need to authenticate the client except for potentially rate limiting issues, but there's *no authentication of the server*. This means that if anyone is able to hijack your connection to the mining pool, they can ask you to start mining for them, and you can't detect it until the pool pays you less money than you expected.
I was anticipating this happening with a DNS spoofing attack, but this particular article is about BGP. Doing a MITM of an unencrypted and unauthenticated stream is a very basic level of attack capabilities, and there are a number of different vectors to do it. The Wired article blames BGP, which I think is the wrong conclusion. It's up to the pool operators and mining-client-writers to come up with some sort of authentication scheme, and then get everyone to switch to it. Until then, it seems well within the NSA's means to hijack all of the largest pools and take over the bitcoin blockchain if they wanted to.
I've seen the Mill CPU come up a number of times -- maybe because I subscribed to their updates and so I get emails about their talks. They're getting a bunch of buzz, but every time I look at their docs or watch their videos, I can't tell -- are they "for real"? They certainly claim a large number of benefits (retire 30 instructions a cycle! expose massive ILP!), but it's hard to tell if it's just some guy claiming things or if there's any chance this could happen.
They make a big deal out of their founder's history: "Ivan Godard has designed, implemented or led the teams for 11 compilers for a variety of languages and targets, an operating system, an object-oriented database, and four instruction set architectures." At first I thought this was impressive, but I decided to look into it and I can't find any details about what he's done, which isn't a good sign. If we're counting toy projects here, I've defined 5 languages, an ISA, and an OS -- which is why we don't usually count toy projects.
They revealed in one of their talks too that they don't have anything more than a proof-of-concept compiler for their system... but they have "50-odd" patents pending? They said it's "fairly straightforward to see" the results you'd get "if you're familiar with compilers", and when more hard questions were asked Ivan started talking about his credentials. I feel less convinced...
This sounds like a lot of stuff that's been attempted before (ex Itanium) -- unsuccessfully. They have some interesting ideas, but no compiler, and (if I remember correctly) no prototype processor. It bugs me too when people over-promise: Ivan talks about what they "do" rather than "plan to do" or "want to do", or "have talked about doing", which feels disingenuous if it's just a paper design right now.
The more I look into the Mill the more I don't think it's real; I think it'll fizzle out soon, as more people push for actual results rather than claims. It's a shame, since I think it's always cool to see new processors with new designs, but I don't think this will end up being one of them.
There's a cool-looking competition being held right now, called The Hackaday Prize. I originally tried to do this super-ambitious custom-SBC project -- there's no writeup yet but you can see some photos of the pcbs here -- but it's looking like that's difficult enough that it's not going to happen in time. So instead I've decided to finally get around to building something I've wanted to for a while: an FPGA raytracer.
I've been excited for a while about the possibility of using an FPGA as a low-level graphics card, suitable for interfacing with embedded projects: I often have projects where I want more output than an LCD display, but I don't like the idea of having to sluff the data back to the PC to display (defeats the purpose of it being embedded). I thought for a while about doing either a 2D renderer or even a 3D renderer (of the typical rasterizing variety), but those would both be a fair amount of work for something that people already have. Why not spend that time and do something a little bit different? And so the idea was born to make it a raytracer instead.
I'm not sure how well this is going to work out; even a modest resolution of 640x480@10fps is 3M pixels per second. This isn't too high in itself, but with a straightforward implementation of raytracing, even rendering 1000 triangles with no lighting at this resolution would require doing three *billion* ray-triangle intersections per second. Even if we cut the pixel rate by a factor of 8 (320x240@5fps), that's still 380M ray-triangle intersections. We would need 8 intersection cores running at 50MHz, or maybe 16 intersection cores at 25MHz. That seems like a fairly aggressive goal: it's probably doable, but it's only 320x240@5fps, which isn't too impressive. But who knows, maybe I'll be way off and it'll be possible to fit 64 intersection cores in there at 50MHz! The problem is also very parallelizable, so in theory the rendering performance could be improved pretty simply by moving to a larger FPGA. I'm thinking of trying out the new Artix-series of FPGAs: they have a better price-per-logic-element than the Spartans and are supposed to be faster. Plus there are some software licensing issues with trying to use larger Spartans that don't exist for the Artix's. I'm currently using an Spartan 6 LX16, and maybe eventually I'll try using an Artix 7 100T, which has 6 times the potential rendering capacity.
These calculations assume that we need to do intersections with all the triangles, which I doubt anyone serious about raytracing does: I could try to implement octtrees in the FPGA to reduce the number of collision tests required. But then you get a lot more code complexity, as well the problem of harder data parallelism (different rays will need to be intersected with different triangles). There's the potential for a massive decrease in the number of ray-triangle intersections required (a few orders of magnitude), so it's probably worth it if I can get it to work.
Part of the Hackaday Prize is that they're promoting their new website, hackaday.io. I'm not quite sure how to describe it -- maybe as a "project-display website", where project-doers can talk and post about their projects, and get comments and "skulls" (similar to Likes) from people looking at it. It seems like an interesting idea, but I'm not quite sure what to make of it, and how to split posts between this blog and the hackaday.io project page. I'm thinking that it could be an interesting place to post project-level updates there (ex: "got the dram working", "achieved this framerate", etc) which don't feel quite right for this, my personal blog.
Anyway, you can see the first "project log" here, which just talks about some of the technical details of the project and has a picture of the test pattern it produces to validate the VGA output. Hopefully soon I'll have more exciting posts about the actual raytracer implementation. And I'm still holding out for the SBC project I was working on so hopefully you'll see more about that too :P
For fun, I put some 0201 capacitors behind a BGA part in this board. I decided to try it, and surprisingly it was possible. Not something I want to do again though.
Long story short, I decided to try out an interesting new PCB-manufacturer, dirtypcbs.com. I decided to compare it against my current go-to, OSH Park, so I ran a new 4-layer board of mine through both. The 4-layer service at dirtypcbs was only just launched, and I had to ask Ian to let me in on it, and I think it's important to take that into account. Here are some quick thoughts:
The easiest thing to compare.
- OSH Park: $60: $10/in^2 at 6 in^2 (56x70mm), with free shipping.
- Dirty pcbs: $100: $50 for boards, $25 for rush processing, $25 for fast shipping. (Note: the prices have changed since then.)
For this size board, OSH Park wins. I also made a 100x100mm board through dirty pcbs in this same order, which came out to $75 ($50 + $25 for rush processing, got to share shipping charges), vs $155 it would have been on OSH Park.
So not hugely surprising, but due to OSH Park's linear pricing model, they are more price-effective at smaller board sizes.
I ordered both boards on 7/3 before going off for a long weekend.
The OSH Park panel was dated for 7/4, but didn't go out until 7/7; probably good since it seems like the cutoff for getting in on a panel is the day before the panel date. The panel was returned to OSH Park on 7/16, they shipped by boards that day, and I received them on 7/18. 15 calendar days, which is slightly better than the average I've gotten for their 4 layers (seems to depend heavily on the panelization delay).
dirtypcbs: there were some issues that required some communication with the board factory, and unfortunately each communication round trip takes a day due to time zone issues. The boards seem to have gotten fabbed by 7/8 -- not quite the "2-3 day" time I had been hoping for, but still way faster than OSH Park.
I didn't end up receiving the dirtypcb boards until 7/22, and I'm not quite sure what happened in between. Ian was, to his credit, quite forthright about them still figuring out the best processes for working with the new 4-layer fab, which I think delayed the shipment by about a week. I'm not quite sure where the rest of the delay comes from -- perhaps customs? DHL reports that the package was shipped on 7/21 -- which is amazing if true, since I received them the next day.
So overall the total time was 19 calendar days, which was a little disappointing given that I had paid extra for the faster processing, but understandable given the situation. The winner for this round has to be OSH Park, but dirtypcbs clearly has the ability to get the boards to you much faster if they can work out the kinks in their processes.
Here's a picture of the two boards -- as you can see they both look quite excellent:
There's a silkscreen ID code on the dirtypcbs board, but they were very considerate and put it under a QFP part where it won't be visible after assembly.
One thing that's nice about going with a non-panelized service is that they can chamfer the board edges for you. These boards use a PCI-Express card edge connector, for which you're supposed to chamfer the edges (make them slightly angled) in order to make insertion easier. The dirtypcbs fab ended up doing that for me without it being asked for, though it's quite subtle:
Overall, it's definitely nice to go with a non-panelizing service, since you get clean board edges and potentially-chamfered edges if you need it. Typically the panel tabs that get left on the OSH Park boards aren't anything more than a visual distraction, but they can actually be quite annoying if you try to apply a solder paste stencil, since it becomes very tricky to hold the board steady. Also, it makes it very difficult to stencil multiple boards in a row, since they will all break slightly differently.
Another benefit is that dirtypcb gives you the option of different soldermask colors, with anything other than green costing $18 (for their 4-layer options -- for their 2-layer the colors are free). OSH Park doesn't charge you for color, but your only option is purple.
Dirtypcb only offers HASL finishing for their 4-layer boards whereas OSH Park offers the apparently higher-quality ENIG finish. I'm not quite sure how that affects things (other than ENIG being lead-free), so I'm not sure how to rate that.
So overall I'd say that dirtypcbs wins this category, due to being non-panelizing: you get clean edges, and you can choose your PCB color.
This one's slightly hard for me to judge, since I'm not quite sure what I'm looking for. OSH Park has better tolerances than dirtypcbs, though since I wanted to have the same board made at both, I used the safer dirtypcbs tolerances.
One thing that I was worried about was this 0.4mm-pitch QFP chip that takes up most of the top side. Unfortunately, the dirtypcbs fab isn't able to lay soldermask this finely, so the entire pad array is uncovered:
They also don't have any soldermask dams on the 0.5mm-pitch QFN at the top of the photo.
I did, however, specify soldermask there, and OSH Park was able to do it. The registration between the soldermask and the copper layers are slightly off, by about 2mil, which is a little disappointing but probably nothing to worry about:
Here's the other tricky section of the board: an 0.8mm-pitch bga:
Both fabs handled it without problems.
I haven't electrically tested any of the boards, but these images seem to show that they're both electrically sound.
So I'd say that OSH Park edges out dirtypcbs in this category -- the dirtypcb PCBs are definitely high-quality but OSH Park is a slightly better still.
I decided to also order a stencil through dirtypcbs, since they offer steel stencils for $30, which is way way cheaper than I've seen them elsewhere. This is what I got:
That's a huge box! What was inside?
Ian was also surprised that they sent something this large :) I think I have to try using it once but it doesn't seem very easy to use... It looks very high quality, though, and they also touched up my stencil design for me. I'm pretty sure all the changes they made were good, but they did things like break up large exposed pads into multiple paste sections. They also covered up some of the large vias I put in there for hand-soldering the exposed pads -- usually I mark those as "no cream" in Eagle (don't get an opening in the stencil) but I forgot for these.
OSH Park doesn't offer stencils, but a similar service OSH Stencils does (no official relation, I believe). I've used them a few times before and had great experiences with them: they offer cheap kapton stencils, and get them to you fast. Here's what they look like:
I haven't tried using either set of stencils yet, because unfortunately the circuit is broken :( I have a lot of these circuit boards now though so maybe even if I don't assemble any more of the boards I'll try out the stencils in the name of science.
Regardless, I think I'm going to stick with OSH Stencils for now :)
So that's about it for what I looked at or noticed. I think I'm going to stick with OSH Park for small boards for now, but the option of getting 10 4-layer 10x10cm boards from dirtypcbs for $50 is pretty crazy, and opens up the possibility of using boards that size. If dirtypcbs can work out the kinks of their process with the fab, then they also have the potential to deliver circuit boards to you much much faster than OSH Park, and much much more cheaply than places that specialize in fast turnarounds. So overall I'm glad I ordered from them and I'm sure I will again at some point.
In some of my recent boards, which I will hopefully blog about soon, I decided to add some DRC-violating sections to test how well they would come out. OSH Park has pretty good tolerances -- 5/5 trace/space with 10 mil holes and 4 mil annular rings, for their 4-layer boards -- but they're not *quite* good enough to support 0.8mm-pitch BGAs. You can fit one of their vias in between the BGA pads, but you can't end up routing a trace between two 0.8mm-pitch vias. It's very close to working -- one only needs 4.5/4.5-mil trace/space in order to get it to work. I asked one of the support people at oshpark.com what they suggested, and they said that they've seen people have luck violating the trace/space rules, and said to not try violating the via rules (it's not like they'll somehow magically make a smaller hole -- makes sense). I had a tiny bit of extra room in some recent boards so I decided to put this to the test, before incorporating this into my designs. I took some pictures using a cheap USB microscope that I bought.
My first test was to use a comb-shaped polygon fill. The comb consists of 4 triangles, which go from a point (0-mil "width") to an 8-mil width. The goal was to test how small the feature size could be. I put some silkscreen on it to mark where the triangles had 0/2/4/6/8-mil width. Here's what I got (click to enlarge):
You can see that they were able to produce what are supposed to be 2-mil traces and 2-mil spaces, but beyond that the traces disappear or the triangles become solid. I don't really have a way of measuring if they actually made them to these dimensions, but they seem like they're approximately the size they should be.
Just because the minimum feature size is potentially 2mil doesn't mean that you can use that reliably in your designs. I came up with a sub-DRC test pattern, and ran it against a number of different trace/space combinations. Here are some results for 4/4 and 6/3:
In the both pictures, the 4/4 looks surprisingly good. The 6/3 looks like it's pushing it on the spacing, but electrically these simple test patterns seem to have come out ok (the two separate nets are continuous and not connected to each other). That doesn't mean I trust that I could use 6/3 for an entire board, and I doubt I'll ever try it at all, but it's cool to see that they can do it.
One interesting thing to note is the problems with the silkscreen in the first "4" in "4/4". Interestingly, the problem is exactly the same in all three boards. You can see a similar problem with the bottom of the "6" and "3", but I feel like that's reasonable since I have exposed copper traces right there and the board house presumably clipped that on purpose. I don't understand why the "4" got the same treatment, though.
Here are some tests that worked out slightly less well:
The 3-mil traces did not survive, and ended up delaminating in all three boards. You can see though just how good the 5/5 traces look in comparison.
Luckily, on a separate set of boards I had also included this same test pattern, but in this case mostly covered with silkscreen. These actually seem to have worked out just fine:
I doubt that I'd ever feel comfortable going this small -- a small test pattern on a single run of boards doesn't prove anything. But seeing how well these turned out makes me feel much more comfortable using 4.5/4.5 trace/space for 0.8mm-pitch BGA fan-out, especially if I can keep the DRC violations on the outer layers where they can be visually inspected.
0.8mm-pitch BGAs would still be quite difficult to do on a 4-layer board, for any decent grid size. If it's small or not a full grid it's easier -- I was able to route a 0.5mm-pitch BGA on OSH Park's 2-layer process, since it was a 56-ball BGA formatted as two concentric rings. It's also not too difficult to route an 0.8mm-pitch BGA DRAM chip, since the balls again are fairly sparse.
I'm looking at some 256-ball 0.8mm-pitch BGAs for FPGAs or processors, which may or may not be possible right now. These tests show me that there's at least in the realm of possibility, but it might only be practical if there are a large number of unused IO balls.
In my conversation with OSH Park, though, they said they want to start doing 6-layer boards eventually, which are likely to come with another tolerance improvement. I told them to count me in :)
Update: wow, wordpress really made a mess of those images. Sorry about that.
It's been almost exactly a year since I first got a 3D printer, and a couple things have conspired recently to convince me to take it off the shelf and try using it again. The most pressing need is for more parts boxes for organizing SMD parts: I use coin envelopes for storing cut strips of SMD components, and then use some custom-sized 3D printed boxes for storing them:
I'm starting to run low on these, plus I wanted to have a slightly different design: the boxes are great, but the organizational unit of "a box" is slightly too large for some purposes, and I wanted to add some ribs so that there can be some subdivision inside each box. These part boxes are pretty much the only useful thing I've ever done with my 3D printer, so I was excited to have an excuse to try using it again!
Installing Printrbot upgrades
My printer is an "old" Printrbot Simple -- one of the first versions. 3D printers as a business is an interesting one: things are moving very quickly, so as a company, what do you do for your users that bought old versions? My guess is that most companies revel in the opportunity to sell you a brand new printer, but Printrbot has an interesting strategy: they will sell you upgrades that let you mostly retrofit your old printer to have new features of a new one. It's not as easy as simply buying one of their new models, but if you want to follow along with their latest trends it's cheaper to get the upgrades instead of a new model every time.
I bought some of their upgrades: a "build volume upgrade" and a "tower" upgrade. There were some issues installing them since apparently my printrbot is too old and the upgrade, even though designed to work with it, has its documentation written for a newer model. Anyway, I got them installed without too much trouble, and in the process installed the endstops and fan from the original kit (which were themselves upgrades).
And this is what I got:
So as I should have expected, there were a large number of issues.
Problem #1: slantedness
All the prints were coming out slanted on the x axis. It's hard to know exactly why, since there are a couple things that changed: there's a new printbed (what gets moved by the X axis), and I had re-fishing-line the X axis as well. I dealt with this problem for a long time in the past -- I spent several full days dealing with it when I first got the printer. The thing that ended up working originally was I replaced the provided polyfilament fishing line with monofilament fishing line, and it magically started working. Well, I'm using monofilament line, though it's not the same as on the Y-axis -- I think I'm using stronger, but therefore thicker, line, and I wonder if that's an issue. I tightened things up again and the prints are coming out better but still slanted (maybe 10 degrees instead of 30).
Problem #2: cable management
I had originally tried hooking up the fan from the original fan upgrade I got, and this required running another pair of wires through the cable harness. I also had to undo the cable ties I had set up to keep the cabling neat, in order to install the "tower" upgrade. The result of these two things was that the cable harness started running into the print! You can see that in the second picture in the back starting about 40% of the way into the print; the effects end about 60% of the way since I taped the wires out of the way as a proof-of-concept fix. I ended up sending the stepper motor wires over the stepper motor instead of under it as they suggest, and it started working magically.
Problem #3: print consistency
This one I don't really understand, but there are a couple symptoms: first is that the prints are visibly not very "full" -- you can see in the pictures that you can see the blue painter's tape through gaps in the bottom two layers. The second symptom is that sometimes I will hear some noises coming from the extruder; on investigating, I saw that it doesn't pull any filament in during those events, and also that there is some white dust (ground filament line) accumulating in extruder chamber, and clogging up the hobbled bolt. My first theory is that this could potentially be due to the filament: I haven't used the filament in about a year, and haven't done anything special to store it. There are reports on the internet that PLA will take on water over time, resulting in various issues; I didn't see anyone say that chipping the filament was one of them, but who knows it's possible. (Side-note: if something gets shipped in a bag with a desiccant, it's probably best to store it in the bag with the desiccant. Live and learn.)
So I switched to some different filament I had, and had some similar issues. It probably wasn't the best test since I got this filament from the same place (both came from printrbot.com), but it ended up not being too big a deal since I tried something else to fix the issue: I increased the temperature.
Unfortunately I lost pretty much all the settings that I had originally used, so I just started from scratch again, and I was using the default 185C PLA temperature. I tried increasing it to 190C and then 195C, and got dramatically better prints. You can see in this picture the difference it made: the left is with the original temperature (185C) and the new filament (pink), and the right print is the same exact model but with a 195C extrusion temperature.
The print quality at the higher temperature is, quite simply, amazing. There is far better adhesion between the layers, better structural strength, better layer consistency, you name it. There's only one tiny defect on the second print, and that's due to having to swap out the filament in the middle of the print (you can see it about 20% through the print). The right model is also taller since the print for the one on the left failed towards the end, and didn't complete the full model.
Not everything is perfect though; if you look closely at the top two prints in the following picture you can see that they're both slightly slanted. Interestingly, they're slanted in different directions! (you'll have to trust me that those are the orientations in which they were printed.) The top-right print is a slightly different model which I assume explains the different slant angle. It surprises me though how much the slant angle can remain consistent throughout the height of the object -- I would have thought any slippage would be random. (The deterministic nature of it originally led me to hunt down potential software bugs for a few days when I first got the printer, which is one reason it took so long to go back to investigating the fishing-line belt as the culprit).
Fortunately, these parts boxes are pretty forgiving of slant, especially in the X direction (the Y direction would have been harder since the envelopes would eventually start not fitting), so these two boxes are still entirely usable.
My new modeler: OpenSCAD
Previously, I had used Blender for creating my 3D models. Blender is a tool mostly designed for artistic 3D modeling, though it's still a very capable 3D modeler. Consider the problem: I know the inner dimensions of the box that I'd like, and I'd like to design a containing structure that respects the cavity dimensions. With Blender you can certainly do it, but it's a lot of adjusting of coordinates, which is not what the UI is designed for. There are also issues stemming from the fact that Blender is a surface modeler, and not a solid modeler: for graphics you don't need the notion of "this is a solid object with faces on all sides", but for printing out 3D parts that's critically important! The tools will try to figure all of that out for you, but I did have to spend a fair amount of time twiddling face normals in Blender any time I did a boolean operation.
OpenSCAD, in contrast, is extremely well suited for this kind of problem. It's all text-based; maybe I'm partial due to being a programmer, but it feels much easier to adjust the model when the coordinates are explicit like that. It also some limited programmability, so it was very easy to parameterize both the box thickness and the number of ridges: in the above picture, you can see that the second print is thicker and has 4 ridges instead of 3. OpenSCAD was also far simpler to get set up with; not that Blender is particularly hard, but it probably took me about 30 minutes to go from never having used OpenSCAD to installing it and having the model.
The downside is that the visualizations aren't as good -- go figure. I'm going to stick with OpenSCAD, but if I start doing more complicated models I'll have to learn more about their visualization interface. Also I'll want to figure out how to integrate it with an external editor (vim) instead of using their builtin one.
There are still a number of things that need to be fixed about this setup. First is the X-slant, clearly. Second is I need to figure out a good solution to the filament feeding problem. The "tower" upgrade comes with a spool holder on top of the printer which seems perfect, but I actually found it to be highly non-ideal: the printrbot is extremely susceptible to any Z forces on the extruder, since it is cantilevered out a fair amount. With the filament spool above the extruder head, there would be a varying amount of force pulling the extruder up towards the spool, resulting in the print head bobbing up and down as the spool wound or not. One would hope that the spool holder would result in low enough friction that the force on the extruder head would be minimal, but in practice it was a deal-breaker.
So I've gone back to putting the spool adjacent to the printer, using my 3D printed spool holder (the only other useful thing I've ever printed). I did buy the Printrbot discrete spool holder, but it varies between ok and terrible, depending on the spool that you try to use it with. They have a new hanging spool holder which seems promising; I may either buy it or try to design a similar one of my own.
I need to figure out what the deal is with the white filament: will the new temperature produce the same changes for that one as well? Or maybe I need to tinker with the extruder setup some more (too much idler pressure? not enough idler pressure?). Should I figure out some other way of storing all my filament?
I also want to upgrade my toolchain: a lot of things have moved on in the past year. Slic3r is now on a much newer version that hopefully fixes a number of the crashes I run into; PrintRun (prontrface) is apparently not the preferred print manager anymore, and I bet there are a number of improvements to the Marlin firmware for the printer itself.
3D printing feels much more like carpentry than printing. The tools are getting much more developed and the general body of know-how continues to build, but you still have to invest a lot of time and energy into getting the results you want. I wanted to say that it's disappointing that things are still there after a year, but then again I'm still using the same printer from a year ago so it's not clear what could have changed :P Printrbot has a new metal printer that seems like it could be much better, so maybe with a better printer certain aspects such as the cabling and the slantedness will be fixed. But there will still be the craft-like aspects of knowing what temperature to run your extruder at, your slicer settings, and so forth.
I'm going to give the X axis another go, and if I can get it printing straight then I think I'll be extremely pleased with where the print quality has ended up. I still have to find things that I want to print though; I think there could be a lot more cool opportunities around parts organization.